Onsemi Has Introduced New Silicon Wafer Platform

The company's new technology embeds power systems directly onto silicon wafers to improve electric vehicle efficiency.

Updated on Sept. 21, 2026 in Semiconductors

Isometric editorial illustration of circular silicon wafers with geometric circuit patterns on a dark surface.
Onsemi has launched its new Embedded Power Platform, a 12-inch silicon wafer technology designed to increase power density and thermal efficiency in electric vehicles. AI Illustration. Upload story photo >

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Onsemi has launched its Embedded Power Platform, which replaces traditional printed circuit board substrates with 12-inch silicon wafers. This new methodology integrates various power components to address thermal limitations and power system complexity.

Why it matters

By moving components off standard boards and onto silicon, manufacturers can achieve significant gains in power density and thermal management. This shift seeks to lower power losses in electric vehicles while reducing the physical footprint of essential hardware.

The platform utilizes 12-inch silicon wafers to achieve power density gains of up to 5x. Solid-state circuit breakers built with this technology operate 20% cooler than standard components.

The players

Onsemi

Onsemi is a semiconductor supplier that focuses on energy-efficient power and sensing technologies for automotive and industrial markets.

Subaru

Subaru is a global automotive manufacturer that has partnered with Onsemi to implement this new power platform in its electric vehicles.

The details

The technology embeds power semiconductors, drivers, and controllers within a single silicon wafer substrate rather than mounting modules on a separate circuit board. This co-optimization allows for improved electrical, thermal, and mechanical performance across the entire power system.

Timeline

  1. Wider sampling and additional partners are expected later in 2026.

The Tech Race

The transition to wafer-based power integration represents a departure from traditional printed circuit board substrate manufacturing. This technology positions Onsemi to lead the shift toward more efficient, compact power modules in the competitive electric vehicle semiconductor sector.

Users of future electric vehicles featuring this technology may benefit from increased range due to significantly lower power losses. Manufacturers using these components can create more compact systems, potentially leading to more efficient vehicle interior designs.

The takeaway

This innovation demonstrates how semiconductor companies are moving beyond simple component supply to redefine the mechanical architecture of vehicles. Implementing these wafer-based systems is becoming a critical strategy for manufacturers aiming to maximize efficiency in electric powertrains.

Further reading

For more on the current manufacturing trends in the industry, visit the Semiconductors section.

Source note: This article includes information reported by Wccftech.

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