TSMC and Samsung Purchased ASML Lithography Tools
The chipmakers secured high-end machines to advance production for future AI processors and memory.
Updated on Sept. 19, 2026 in Semiconductors
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TSMC and Samsung have signed contracts to acquire High-NA EUV lithography machines from ASML. These tools are essential for etching the smallest transistors required for next-generation AI processors.
Why it matters
High-NA EUV optics reduce the printable field size by nearly half compared to older tools, making them necessary for manufacturers to achieve the extreme precision needed for future chip designs.
Each High-NA EUV machine costs $400 million and enables a shift from 6-inch to 12-inch photomasks. This larger canvas size helps offset the reduced printable field size inherent to the new optics.
The players
ASML
Headquartered in Veldhoven, Netherlands, the company is the world leader in photolithography systems for the semiconductor industry.
TSMC
Based in Taiwan, this company is the world's largest contract semiconductor foundry and a critical supplier for major tech firms.
Samsung
This South Korean multinational conglomerate is a major global player in the production of semiconductors, memory chips, and consumer electronics.
Intel
This American technology firm is a major semiconductor manufacturer that has already integrated High-NA EUV tools into its research and production workflows.
The details
The industry is moving toward a 12-inch photomask standard to provide a larger canvas for these new tools, replacing the legacy 6-inch format. While Intel has already run over a million wafers through its existing machines, TSMC and Samsung are now formalizing their own deployment plans.
Timeline
September 8, 2026: TSMC and Samsung announced the purchase of the new ASML machines.
Q4 2026: ASML aims to achieve 90% fleet availability on its High-NA systems.
2028: Samsung expects to utilize the technology for DRAM manufacturing.
2030: TSMC targets the start of high-volume production using the new tools.
2031: The industry anticipates piloting 12-inch photomask production lines.
The Tech Race
The adoption of the 12-inch photomask standard marks a critical evolution in semiconductor manufacturing, effectively replacing the aging 6-inch format. This shift positions chipmakers to handle the increased complexity of future nodes, further intensifying the global competition for advanced production capabilities.
These machines will enable the production of smaller, more powerful processors that will eventually power consumer devices and high-performance AI services. Users may see these advancements translate into faster computing speeds and more energy-efficient hardware over the coming decade.
The takeaway
The move to High-NA EUV lithography represents a massive capital investment aimed at overcoming the physical limits of current chip-etching processes. This transition is essential for maintaining the pace of computing power improvements required for the next generation of artificial intelligence.
Further reading
For more on the industry shift toward advanced nodes, explore the latest trends in Semiconductors.
Source note: This article includes information reported by Startup Fortune.
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